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Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn.
PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the chips,make sure the rework rate.
Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode[preheating,constant,warming,soldering,reflow soldering,cooling.
Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction model weld,remove,mount,manual,realize semi auto and auto function ,meet customer’s requirement
High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1 degree
Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
Top heater and mounting heater design 2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.
High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result.

Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )

 Technology Parameter of WDS-750 BGA Rework Machine

Power	6800W
Up heater power	1200W
Down heater power	1200W
IR heater power	4200W(2400W control)
Power supply	(Single Phase)  AC 220V±10 50Hz
Position way	Optical lens+ Vshape holder+laser positioning
Temperature control	High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃
Material	High sensitive touch screen+temperature control module+PLC+step drive
PCB Size	Max:500×450mm ， Min: 10×10mm
Thermo-couple Ports	4pcs
Chips magnification times	2-30
PCB thickness	0.5-8mm
BGA size	0.8mm-8cm
Min.chips pitch	0.15mm
Mounting BGA weight	1000G
Mounting precision	±0.01mm
Overall dimension	L670×W780×H850mm
Optical alignment lens	Motor drive can move front back right left
Weight of machine	About 90kg

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